Xiaomi Mi Game Notebook 15.6 i7 16GB + 256G 7700HQ 1060 6GB

The configuration information, motherboard and related pictures of this page are mainly promoted by the Xiaomi game top version (i7/GTX1060/256GB). The specific performance and data vary according to the model. For more information, please refer to the model configuration. Check the parameter page. The six-core standard pressure processor refers specifically to the eighth-generation Intel® Core i7-8750H, the eighth-generation Intel® Core i5-8300H is a quad-core standard pressure processor, and the standard pressure processor refers to the mobile low-voltage processor TDP 15W. The standard pressure processor TDP is 45W. CPU multi-core computing data from Xiaomi Lab, based on i7-8750H/GTX1060/16G configuration, using Cinebench R15 software, compared with the millet game i7-7700HQ/GTX1060/16G configuration for comparison. The four-zone backlight does not include a power button. The metal cover does not include an antenna slot. The graphics card comparison data comes from NVIDIA official data. The upgradeable dual memory slot refers to the SO-DIMM memory module design scheme, which supports memory module replacement and upgrade. The dual SSD mode means that the second M.2 PCIe/SATA SSD card is reserved for the millet game, which can be replaced with the mechanical hard disk. The overall cooling efficiency of the whole machine is increased by 60%. Compared with the traditional cooling system design (plastic fan blade, 5V fan drive motor, double rear air outlet), the millet game book (GTX 1060) has a 60% increase in overall airflow after the rapid mode is activated. The 12V drive motor is the fan configuration of the 1060 model of the Xiaomi game. Compared with the aluminum-magnesium alloy material on the bottom of the millet notebook Pro, the stiffness of the style grille is increased by 2 times. The opening ratio of the entrance grille is 46%, which is the ratio of the opening area of ​​the stainless steel grille (the sum of the opening + the cross-sectional area). The 3+2 large-diameter heat pipe refers to a total of three heat pipes in the chip area of ​​the graphics card, and two heat pipes in the CPU chip area. The design heat transfer capacity increase of 25% is calculated by comparing the 2+2 type heat pipe layout. The 50% increase in the external diffusion heat is calculated from the area of ​​the conventional game heat sink. The heat dissipation efficiency of the four air outlets is increased by 16%. Dolby panoramic sound effects are experienced by wearing headphones. The programmable button refers to the shortcut key, application and other function settings of the five macro buttons through the Xiaomi game box. The front no logo design refers to the front case, and the notebook screen and bottom case contain the trademark MI logo. The thickness of the whole machine is 20. 9mm, does not include the bottom stainless steel into the grille and foot pad. The screen, motherboard, etc. are schematic diagrams, which are subject to the actual product. The memory capacity, size and thickness, screen opening and closing angle and other data on this page are theoretical values, and there is a reasonable error in the actual measurement. The UHS-I 104MB/s card reader is designed according to the SD Association SDR104 specification. The product station does not specifically point out that it is the data provided by our laboratory data, design technical parameters and suppliers. The actual situation of the whole station data will be slightly different due to different test software versions, specific test environments and specific versions.